Product Overview
The Multi-Functional Integrated Measurement Attachment is a high-precision auxiliary measurement system designed for wide-angle goniometers. Multi-Functional Integrated Measurement Attachment is primarily used for comprehensive structural analysis of sheet materials, bulk materials, and films attached to substrates. It is capable of performing various advanced testing tasks, including phase identification, orientation degree measurement, texture analysis, stress testing, and thin-film in-plane structure characterization. By integrating multiple motion axes, this attachment provides a powerful platform for the study of material microstructures and mechanical properties.
Features
The core functionalities of Multi-Functional Integrated Measurement Attachment are reflected in its diverse testing modes and high-precision motion control:
Pole Figure Testing: Supports pole figure mapping using either the transmission method or reflection method, enabling complete characterization of the preferred orientation distribution of grains in polycrystalline materials.
Stress Testing: Features both the side-inclination method and iso-inclination method for stress measurement, offering flexibility to adapt to different experimental designs and sample conditions for accurate measurement of surface and internal residual stresses in materials.
Thin-Film Structure Analysis: Equipped with sample in-plane rotation (β-axis) capability, making it particularly suitable for studying anisotropic thin-film materials and analyzing crystal structural information along different in-plane directions.
Multi-Axis Synchronized Precision Control: Achieves precise adjustment of sample spatial posture and positioning for complex scan paths through the coordinated movement of high-precision Alpha (tilt), Beta (rotation), and Z (lift) axes.
Application Fields
Multi-Functional Integrated Measurement Attachment has a wide range of applications, covering nearly all advanced material fields requiring in-depth analysis of crystal structure and stress state:
Metallic Materials: Used to evaluate the aggregate structure (texture) of rolled sheets and analyze their anisotropy after forming.
Ceramics and Functional Ceramics: Performs orientation evaluation of ceramic materials, which is crucial for understanding their piezoelectric, ferroelectric, and other properties.
Thin Films & Coatings:
Evaluates the preferred orientation of crystals in thin film samples.
Conducts residual stress testing on various metal and ceramic materials to evaluate mechanical properties such as wear resistance and machinability.
Performs residual stress testing on multilayer films, used to predict and prevent film delamination failure.
Analyzes high-temperature superconducting thin films, oxide/nitride films on metal sheets, and multilayer films on glass, silicon, and metal substrates (e.g., magnetic thin films, metal surface hardened coatings).
Polymer & Composite Materials: Used for the structural and performance analysis of macromolecular materials, paper, lenses, and other plating materials.
Technical Specifications
The technical specifications of Multi-Functional Integrated Measurement Attachment reflect its high precision and flexibility. The core parameters are as follows:
Alpha Axis (Tilt):
Dynamic Range: -45° to 90°
Minimum Step: 0.001°/step
Beta Axis (Rotation / In-plane Rotation):
Dynamic Range: 0° to 360°
Minimum Step: 0.001°/step
Z Axis (Lift):
Dynamic Range: 0 - 10 mm
Minimum Step: 0.001 mm/step
Sample Size:
Maximum Sample Diameter: Φ100 mm
Sample thickness is adjustable to accommodate different testing requirements.
