Product Spotlight: Dandong Tongda's X-Ray Crystal Analysis Solutions
Dandong Tongda Science and Technology introduces its advanced X-ray crystal analysis equipment, delivering precision and reliability for industrial applications.
The TDF Series X-Ray Crystal Analyzer combines powerful analytical capabilities with industrial-grade reliability. Featuring four operational windows and PLC control technology, it serves high-end manufacturing sectors including semiconductor wafer inspection, aerospace component stress evaluation, and laser crystal processing.
Our X-Ray Crystal Orientators (TYX-200/TYX-2H8) enable rapid, precise measurement of crystal cutting angles with accuracy up to ±30 arcseconds. Capable of handling samples up to 30kg, these instruments support directional cutting of piezoelectric, optical, laser, and semiconductor crystals.
Both product lines utilize non-destructive X-ray diffraction technology, replacing traditional radioactive methods while improving processing efficiency and accuracy for crystal material research and manufacturing.
