In X-ray diffraction analysis, thin film samples present significant challenges due to their extremely thin thickness, weak signals, and typical attachment to a substrate. Traditional testing methods are prone to interference from substrate signals, causing the signals from the thin film itself to be masked or distorted.
The core design of the parallel beam thin film accessory lies in increasing the length of the grating slices to filter out more scattered rays. This approach offers two significant advantages:
Reduces Substrate Signal Interference: Effectively suppresses non-target signals originating from the sample substrate.
Enhances Thin Film Signal Strength: Makes the analytical signals from the target thin film more prominent, thereby yielding clearer and more accurate analysis results.
Application Fields:
The parallel beam thin film accessory is primarily applied in cutting-edge fields such as environmental protection and electronics. In these industries, the performance of thin film materials often directly determines the quality of the final product.
For example, in the electronics industry, various functional thin films are widely used in products like semiconductor devices, display screens, and solar cells. The crystal structure, orientation, and stress state of the thin films significantly impact their electrical, optical, and mechanical properties. By utilizing the parallel beam thin film attachment, researchers can evaluate these key parameters more precisely, providing robust support for product development and quality control.
Dandong Tongda Science and Technology Co., Ltd. is a National High-Tech Enterprise specializing in the production of X-ray analysis instruments and non-destructive testing equipment. It was also the undertaking unit of the "National Major Scientific Instrument and Equipment Development Project" initiated by the Ministry of Science and Technology in 2013. Tongda Science and Technology has completed the serialization of its two main product lines: analytical instruments and non-destructive testing instruments.
