The Thin Film Attachment, manufactured by Dandong Tongda Technology Co., Ltd., is a specialized functional accessory designed for its series of X-ray diffractometers. It is engineered specifically for high-precision crystal structure analysis of thin-film samples on substrate materials. This attachment is meticulously integrated with the company's diffractometer main units and operates via dedicated software for control and data acquisition. This integrated system provides comprehensive support throughout the entire process, from precise sample positioning to final results analysis.

The core advantage of this accessory lies in its optimized optical design. By utilizing extended slit blades, it effectively filters out scattered radiation generated during measurement. This feature is critical for thin-film analysis because when X-rays strike a sample composed of both a film and a substrate, the resulting signal contains overlapping information from both layers. The typically strong diffraction signal from the substrate can easily overwhelm the faint signal from the thin film, compromising accuracy. The Thin Film Attachment addresses this by physically conditioning the incident and diffracted X-ray beams. It significantly suppresses the background interference from the substrate, thereby enhancing the specific diffraction signal originating from the thin film itself. This leads to clearer, more reliable, and higher-quality test data. The design accounts for the diversity of thin-film samples, making it adaptable for analyzing films with thicknesses ranging from a few nanometers to several micrometers, thus broadening its practical application scope.

As a professional manufacturer of X-ray analysis and non-destructive testing instruments, Dandong Tongda Technology positions this attachment as a key tool for advanced material research, development, and inspection in fields such as environmental protection and electronics. Its core product line, exemplified by the TD Series X-ray Diffractometers, emphasizes high-precision measurement and automated control. This Thin Film Attachment is a vital professional expansion module for these instrument platforms, enabling high-performance analysis of samples with low content or weak signals, such as thin films and coatings. It showcases the company's deep technical expertise in material analysis. Playing a significant role in quality control and R&D within cutting-edge industries like new energy materials and semiconductor coatings, it empowers researchers to gain more intrinsic insights into material structure.