The Multifunctional Integrated Measurement Attachment, developed by Dandong Tongda Technology Co., Ltd., is a precisely designed and powerful sample analysis platform. Mounted on a wide-angle goniometer, it significantly enhances the capabilities of X-ray analytical instruments, enabling diverse and advanced analysis of plate materials, bulk materials, and thin films on substrates.

Core Functions and Technical Features

The core value of this sample stage lies in its multifunctional integration, primarily applied in three key areas:

Material Structure Analysis: Precisely performs phase identification and orientation degree detection, providing crucial data for researching the crystal structure and texture (preferred orientation) of materials.

Stress Testing: Can be used for residual stress testing and analysis, which is vital for evaluating the wear resistance, machinability of metal and cramic materials, and the delamination risk of multilayer films.

Thin Film Analysis: Specifically designed for thin film samples, enabling in-plane structural testing of thin films, particularly suitable for analyzing multilayer films such as magnetic films and metal surface hardening films.

In terms of technical design, this attachment features a multi-axis linkage system that enables fine adjustment of the sample posture:

α-axis (Tilt): Offers a movement range of -45° to 90°.

β-axis (In-plane Rotation): Provides full 360° rotation.

x, y, z axes: Provide a translation range of ±10mm, facilitating precise positioning of the sample area.

All axes move with a fine step of 0.001° or 0.001mm, ensuring extremely high positioning accuracy and measurement repeatability. Regarding measurement methods, it supports pole figure testing using both transmission and reflection methods, and stress testing using either the iso-inclination or side-inclination method, offering flexible methodologies adaptable to various research and industrial inspection needs.

The Multifunctional Integrated Measurement Attachment is a multi-degree-of-freedom precision motion platform. It not only possesses rotation capability but also integrates various motion modes like tilt and translation, specifically designed for accomplishing more advanced and complex analytical tasks such as texture, stress, and thin film in-plane structure analysis.

Primary Application Fields

Leveraging its powerful features, this attachment is widely used in numerous advanced fields, including but not limited to:

Evaluation of metal aggregate structures (e.g., in rolled plates).

Assessment of ceramic orientation.

Residual stress testing of various metal and ceramic materials.

Analysis of surface oxidation/nitridation films (e.g., on high-temperature superconducting thin films, metal plates).

Analysis of multilayer films on glass, silicon wafers, and metal substrates.

In summary, this Multifunctional Integrated Measurement Attachment from Dandong Tongda is a high-end accessory that substantially enhances the analytical capabilities of X-ray diffraction systems. It is a powerful tool for pioneering materials science research and precision industrial inspection.