TD-Mini X-ray Stress Diffractometer
The portable X-ray residual stress analyzer is a non-destructive testing device based on X-ray diffraction technology. It is primarily used for measuring surface and near-surface residual stress distribution in materials such as metals and plastics, combining high precision with field adaptability.
- Tongda
- Liaoning,China
- 1—2 months
- 100 units per year
- Information
Dandong Tongda Technology Co., Ltd. introduces the TD-Mini X-ray Stress Diffractometer, an advanced non-destructive testing instrument based on X-ray diffraction (XRD) technology. Featuring innovative structural design and an intelligent operating system, this instrument is specifically engineered for precise measurement of surface and near-surface residual stress distribution in materials such as metals and plastics. It successfully achieves a perfect integration of laboratory-level accuracy and exceptional field adaptability.
Core Product Features:
The TD-Mini X-ray Stress Diffractometer offers significant advantages with its compact size and lightweight design. The entire unit weighs under 15 kilograms, making it highly suitable for rapid on-site measurements and mobile detection tasks. Its user-friendly design philosophy, combined with an intelligently guided interface, ensures operators can quickly master the system and perform complex operations without requiring specialized background knowledge. Meanwhile, the instrument's performance, enhanced by advanced algorithmic processing, fully meets various complex detection requirements, including stress analysis of curved components and specially shaped parts. It demonstrates outstanding measurement efficiency, with single measurement time reduced to mere seconds. When coupled with its automated multi-point scanning function, this significantly enhances inspection workflow productivity. Furthermore, the instrument boasts a wide range of applications, effectively serving multiple critical sectors including industrial manufacturing, aerospace, and the energy sector. It is particularly well-suited for application scenarios such as weld stress inspection, heat treatment process evaluation, and coating stress analysis.
Key Component Technical Specifications:
X-Ray Tube: Utilizes a fine-focus ceramic X-ray tube equipped with a built-in sealed self-circulating cooling system. Unique thermal design ensures stability for continuous 24/7 operation and incorporates automatic over-temperature protection. A variety of target materials are available—including Cr, Cu, Mn, Co, V, Ti, Fe, Mo—to meet the testing requirements of different materials and ensure optimal diffraction signal quality.
Detection System: Configured with a high-speed area-array photon-counting detector that employs advanced silicon strip technology for direct X-ray detection, effectively improving signal acquisition efficiency. This detector features a 640 silicon strip linear array design with an overall counting rate greater than 1×10⁹ cps, offering excellent characteristics such as compact size, fast response, and high sensitivity, guaranteeing measurement accuracy even under weak signal conditions.
Thanks to its innovative portable design, outstanding detection performance, and broad industry applicability, the TD-Mini X-ray Stress Diffractometer has become a reliable and efficient tool in the field of residual stress analysis. The instrument is equipped with professional analysis software that provides comprehensive database support and multiple stress calculation models. It offers robust technical support for quality control and process optimization across various industries, assisting enterprises in achieving precise quality management and process improvements.
