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  • Diffractometer
    Diffractometer
    1. The accuracy of Diffractometer is high. 2. The application range of Diffractometer is wide. 3. Diffractometer is easy to operate, convenient and efficient.
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  • Single Crystal XRD
    Single Crystal XRD
    1.The single crystal machine adopts PLC control technology. 2.Modular design, accessories plug and play. 3.Electronic lead door interlocking equipment with double protection. 4.Single crystal X-ray tube: a variety of targets can be selected, such as Cu, Mo,etc. 5. Single crystal adopts four-circle concentric technology to ensure that the center of no goniometer remains unchanged.
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  • Series X-ray Crystal Analyzer
    Series X-ray Crystal Analyzer
    1. X-ray instrument is easy to operate and fast to detect. 2. X-ray instrument is accurate and reliable, with excellent performance. 3. X-ray instrument has various functional accessories to meet the needs of different testing purposes.
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  • Powder Diffractometer
    Powder Diffractometer
    1. Detector type: Array detector or SDD detector; 2. PLC automatic control calculus, Integration mode conversion, PLC automatically performs PHA, dead time correction 3.Sample measurement type: powder sample, liquid samples, melt-state samples, viscous samples, loose powders, bulk solid samples 4.Available with a variety of diffractometer accessories 5.Maximum output powder: 3kW
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Application of XRD technology in semiconductor industry

2023-09-20

Global semiconductor equipment spending has entered an upward cycle. The application of new technologies and new products such as 5G, Internet of Things, big data, artificial intelligence and automotive electronics will bring huge semiconductor market demand, and the industry will enter a new round of rising cycle. Wafer production, epitaxial growth, packaging and integration at the front end of the entire industry chain, and its process and product quality are directly related to downstream industry applications. Rigaku has a complete system of equipment, such as X-ray diffraction (XRD), X-ray fluorescence (XRF), X-ray reflectometer (XRR) and X-ray topography (XRT), which can be applied to the whole process from wafer production to integrated circuits, and can non-destructive measurement of a number of key process parameters: Such as thickness, composition, roughness, density, porosity, as well as crystal structure and crystal structure defects.



1. In wafer production, the number and type of defects will greatly affect the subsequent steps. X-ray topological imaging (XRT) can clearly observe defects and dislocations on the wafer surface (Figure 1). Help producers to improve the process and control the quality.

crystallographic

Figure 1: Transmission topology imaging of a 4H-sic wafer


2. The uniformity of wafer or epitaxial film can be measured by XRD swing curve function, and the visualization software module provided by Rigaku can also give two-dimensional distribution images, which can intuitively evaluate the quality of the surface (Figure 2).

XRD

Figure 2: Two-dimensional image of AlN film growing on sapphire substrate


3. The thickness of the film can be measured by a high-resolution swing curve, which is non-destructive and highly accurate (Figure 3).

crystal structure

Figure 3: High-resolution swing curve for measuring the thickness of GaN/InxGa(1-x)N films


4. There may be some kind of lattice mismatch during wafer or epitaxial film growth, which will affect the quality of the film. Using Rigaku's special detectors and solutions, reciprocal space testing can be done on SmartLab, where lattice mismatches and crystallographic constants can be seen very intuitively.

crystallographic

Figure 4: high-resolution reciprocal spatial spectrum of GaN105









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